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Qualcomm Snapdragon 8150 Details Surface

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As per current info, the next Qualcomm mobile flagship chipset, the Snapdragon 8150 will be unveiled on December 4. It has already flexed its muscles quite a bit in early benchmarks, including AnTuTu, Geekbench and ai-benchmark with its trendy workloads. Besides performance improvements, it also promises a 20% bump in overall efficiency ( presumably compared to the Snapdragon 845) and will most-likely include 5G connectivity. 


The Qualcomm Invitation

 That pretty much sums up everything most users will need to know about the chip. However, for the more technically-inclined, a fresh new leak, courtesy of Universe Ice, does bring about yet another confirmation of the previously rumoured tri-cluster CPU design. 
As per the info, the Snapdragon 8150 will have four low-power Kryo Silver cores, with 128KB L2 cache each, running at roughly 1.8GHz Max in one cluster, then a trio of Kryo Gold ones, with 256KB L2 cache, per core and a max frequency of 2.419GHz in another cluster. And last, but definitely not least a beefy single Kryo Gold core with double the L2 cache, at 512KB and a maximum frequency of 2.842GHz. 

 Now, the source sadly doesn't mention any additional info on those cores and in Qualcomm's current mess of a naming convention, Gold and Silver can refer to the custom cores. We have no reason to believe that the Snapdragon 8150 won't use the DynamicIQ architecture, so all the flexibility clearly there. 

 There is still no word on the fabrication node for the Snapdragon 8150. The same goes for the LTE Modem and its capabilities. On a different note, we do already know that the GPU will be upgraded to an Adreno 640. We don't really have any performance numbers for the latter, but one can only assume that its incremented model number is there for a reason.


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